NAVIGATING THE DYNAMIC LED & LIGHTING MARKETS

TRACK 3: LED MANUFACTURING CONFERENCE

SPONSORED BY 
 

Supporting Association Sponsor 

SESSION 1: LED Manufacturing Track Plenary Session

Keynote Address #1: The LED Manufacturing Challenge

Wednesday, February 8               1:30pm – 2:00pm

Speaker:
Iain Black
Vice President of Worldwide Manufacturing, Engineering and Innovation
Philips Lumileds Lighting

The evolving LED market represents a range of challenges for the manufacturer. The maturity of processes and equipment, the evolution of product and performance standards and an immature value chain provide an ongoing challenge to addressing the needs of a diverse range of customers.  In particular, the diversity of customers in the illumination market, and the complexity of the LED products and applications, provides perhaps the greatest challenge to low-cost efficient manufacturing.  Decisions as to the right technologies to address system needs require a solid understanding of the application space and system design limitations. That these solutions can include both discrete LED and integrated light engines, potentially place the LED manufacturer in a maelstrom of complexity.  

Iain Black is responsible for the worldwide operations engineering functions at Lumileds, including NPI, sustaining operations, design for manufacturability and product/technology innovation across sites in San Jose, Singapore, Penang and Maarheeze, The Netherlands. In his 25 year career he has worked in a range of process engineering and manufacturing roles within the semiconductor industry, including in the UK at INMOS Ltd. and National Semiconductor. For the last 10 years he has worked in compound semiconductors at Anadigics and Philips Lumileds. He has now served for three years at Lumileds, running the San Jose epi manufacturing facility and introducing the industry’s first 6” HB LED manufacturing operation, before taking on his current position in mid 2010.

Keynote Address #2:  LED Manufacturing Today: Consolidating Expansion and Planning for the Long Haul

Wednesday, February 8               2:00pm – 2:30pm

Speaker:
Karen Savala
President
SEMI

Global LED manufacturing has undergone a dramatic expansion over the past two years as manufacturers have responded to rising LED demand for backlighting applications. But will the capital spending continue in 2012-2013?  And how will manufacturers deliver on major cost reductions—perhaps as much as 20X improvement in $/klm at the packaged LED level—required to support the continued growth of the solid state lighting market? This presentation will review current LED fab capacity by region and provide estimates of capital spending in 2012-2013 time period.  In addition, an update on global efforts towards industry-wide manufacturing standards to enable low-cost automated production will be provided.

Karen Savala is president of SEMI Americas, responsible for all regional events, products, services, and government relations.Savala joined SEMI in 1984 and has served in numerous managerial and executive roles, including positions in International Standards, executive programs, publishing, and membership. SEMI currently serves members in the global LED market through trade events, market data and information programs, public policy advocacy, EHS programs, and manufacturing standards development. 
 

Can a Major Semiconductor Player Accelerate the LED Cost Reduction Curve?

Wednesday, February 8               2:30pm – 3:00pm

Speaker:
Jacob Tarn
President
TSMC – Solid-State Lighting Ltd.

Making a real market for LED lighting applications may depend in large part on the efforts of bringing down the cost of high-brightness LEDs.  The US Department of Energy (DOE) is targeting a 20X cost reduction over the next five to six years to achieve its energy saving goals for the sector. Judging from recent technology progress, practical ways to reach to 20X cost reduction are 1.5-2X efficacy improvement, and 4X-6X improvement in getting more light out with higher drive currents. The rest will have to come from improvements in manufacturing productivity and utilization.  Will the same manufacturing efficiencies that reduced semiconductor and flat panel display costs over the past three decades enable high-brightness LEDs to widely penetrate the general-purpose lighting market? As one of the first major silicon semiconductor companies to begin manufacturing LEDs, TSMC’s perspective on entering this new market, and on the challenges to be overcome in scaling up to very large-volume LED manufacturing, will be presented.

Jacob C.L. Tarn, Ph.D, is the President of TSMC – Solid State Lighting, Ltd.  Before formally joining TSMC’s LED lighting business, he served as the consultant to TSMC’s new business entity between 2008 and 2009. He was the general manager of OCP-Asia from 2007 to 2008, and from 2001 to 2006 he was the CEO of GigaComm Corporation. In 1996 he co-founded Epistar Corporation and served as vice-president and member of the board of directors until 2001. Dr. Tarn holds 30 international patents and has over 100 publications in leading journals.

 
Government-Industry Roadmap Provides Framework for SSL Manufacturing Improvements

Wednesday, February 8               3:30pm – 4:00pm

Speaker:
James Brodrick
SSL Program Manager
Building Technologies Program
US Department of Energy

There is widespread agreement that price and quality are key to market acceptance of solid-state lighting (SSL). But cost reduction is not free and does not occur automatically — it requires a great deal of attention paid to how products are designed and manufactured. This presentation will provide a detailed look at the latest edition of the U.S. Department of Energy’s SSL Manufacturing R&D Roadmap. The result of a highly collaborative and participative process, the roadmap provides a common framework for government-industry efforts to lower the cost and enhance the quality of SSL products through improvements in manufacturing processes and equipment. The latest edition offers a close examination of key cost elements and where future cost reductions will occur, along with cost reduction targets for LED packages ($2/klm by 2015) and OLED panels ($25/klm by 2015).

James Brodrick manages the U.S. Department of Energy’s Solid-State Lighting program, where he has designed a comprehensive strategy to move SSL from lab to market. The program comprises nearly 50 R&D projects that drive technology innovation. Dr. Brodrick also has implemented a broad-based set of commercialization support strategies which closely coordinate with research progress to ensure proper application of SSL products and to avoid buyer dissatisfaction and delay of market development.

SESSION 2: WAFER LEVEL MANUFACTURING ISSUES

Move to Larger Diameter Sapphire Substrates

Wednesday, February 8              4:00pm – 4:30pm

Speaker:
Raja Parvez
President and CEO
Rubicon Technology

In order to support mass adoption of solid state lighting, a shift to larger diameter sapphire substrate size must occur.  Manufacturing efficiencies and cost reductions inherent in the large diameter platform set the stage for scaling up of the entire LED supply chain to meet the growing demand for LED chips.  This presentation will review why a large diameter wafer is essential to driving down costs and increasing yields to support aggressive cost targets of SSL, and will address trends that are on the horizon.

Raja M. Parvez is president and chief executive officer of Rubicon Technology and a member of the board of directors. Prior to Rubicon, Mr. Parvez served as chief operating officer, chief manufacturing officer and vice president at CyOptics, Inc., a designer, developer and marketer of optical components for the broadband industry. Previously, he served as president and vice president of manufacturing at Optigain and was distinguished and consulting member of the technical staff at Lucent Technologies with a focus on operational excellence for Lucent-Optoelectronics products..

How Front-End PEVCD Processing is Keeping Pace

Wednesday, February 8               4:30pm – 5:00pm

Speaker:
Abdul Lateef
CEO
Plasma-Therm


As the LED device market matures and transitions to larger substrates, the tool sets and manufacturing processes must also adjust. While many of the specific front-end plasma processing challenges in LED manufacturing are different than mainstream silicon, the productivity approaches used for silicon are being adapted to achieve similar successes for LEDs.  This talk addresses the considerations and approaches for effectively improving LED manufacturing productivity for plasma enhanced chemical vapor deposition (PECVD) through process, software and hardware implementations.

Abdul Lateef joined Plasma-Therm in 1998 as a Project Manager leading new technology development. Since then, he has held various positions with increasing responsibilities, culminating in his current position as CEO. Lateef is co-author on a patent and several published papers spanning multiple technologies and markets.

SESSION 2: WAFER LEVEL MANUFACTURING ISSUES (cont.)

High Throughput Lithography and Metal Wafer Bonding:
Two Enabling Technologies for Future High-Brightness LEDs

Thursday, February 9              8:30am – 9:00am

Speaker:
Thomas Uhmann
Business Development Manager
Compound Semiconductors and Si-based Power Devices
EV Group

High-brightness LEDs carry a high prospect for general lighting applications, but competition with the cost/performance ratio of current light sources demands an overall efficiency increase as well as dramatic cost reduction. Optical proximity lithography is the patterning technology of choice for HB-LED wafers. Increased throughput of up to 165 wafers per hour (aligned mode), along with system optimization, enables high-yield optical lithography with unmatched cost of ownership. Furthermore wafer bonding is discussed as another enabling technology for active layer transfer. The selection of the substrate, bonding process and material system as well as appropriate adhesion layers and diffusion barriers is essential for a high-yield bonding process.

Thomas Uhrmann is a business development manager for Compound Semiconductors and Si-based Power Devices at EV Group (EVG). In his current role, he is responsible for introducing and managing technological innovations for the fabrication of HB-LEDs.

SESSION 3: METROLOGY AND YIELD MANAGEMENT

Yield Improvement Using Epitaxy Tool, Batch and Pocket Level Analysis in LED Fabs

Thursday, February 9               9:00am – 9:30am

Speaker:
Mike Plisinski,
Vice President and General Manger ,Data Analysis Business
Data Analysis and Review Business Unit
Rudolph Technologies

The U.S. Department of Energy Solid State Lighting R&D Manufacturing Roadmap calls for an 85% reduction in final packaged LED cost in next five years. Better control of the epitaxial process can result in cost savings by improving yield loss (some estimates are that up to 50% of lost yield originates from epi) and reducing process variability.  This presentation will show how data collected across the entire manufacturing process can be used by epitaxial process engineers to improve Cpk (thus reducing packaging costs) and increase yields.

Michael Plisinski has served as Rudolph Technologies’ Vice President and General Manager, Data Analysis and Review Business Unit, since February 2006 when the company merged with August Technology Corporation. From 2003 to 2006, his positions at August Technology included Vice President of Engineering and Director of Strategic Marketing for review and analysis products. Plisinski was founder and President of Counterpoint Solutions, a semiconductor review and analysis company, later acquired by August Technology. 

Optical Testing – An Essential Part of LED Manufacturing

Thursday, February 9              9:30am – 10:00am

Speaker:
Dan Scharpf
General Manager, Systems Business Unit
Labsphere

The growth of the LED market is fueling tighter requirements on LED performance by the designers of displays and luminaires. Historically, optical measurements of LEDs occurred after packaging. By moving the optical testing further upstream in the manufacturing process, yields are increased, binning is more efficient and the cost of manufacturing is reduced. Optical testing now occurs at several steps in the process, including: wafer probing, raw die, taped die, packaged LEDs, and final product.  This presentation reviews the different types of optical testing available and identifies where it is needed at each step in the value chain.

Dan Scharpf, Ph.D. is General Manager of the Systems Business Unit at Labsphere. He received his B.S. from the University of Dayton in Mechanical Engineering, followed by his M.S. and Ph.D. in Aerospace Engineering from the University of Notre Dame. His technical background covers experimental and numerical analysis of fluid mechanics, rotating machinery, thermal analysis and acoustics. 

SESSION 4: PACKAGING

Packaging Trends to Drive Down Cost per Lumen

Thursday, February 9              10:30am – 11:00am

Speaker:
Ilkan Cokgor
Vice President Global Marketing
Everlight Electronics, Co., Ltd.

The need to lower the cost of solid state lighting drives many applications towards PLLC or similar type packages. Performance and reliability demands of lighting applications require the use of new package materials, package technologies and process technologies. This talk will discuss some of these technologies to achieve a low cost, but reliable Led package for lighting.

Ilkan Cokgor is the Vice President of Global Marketing at Everlight Electronics where he is responsible for all Everlight products worldwide. He has over 20 years of research, product development, marketing and sales experience in the fields of optoelectronics, LEDs and solid-state lighting.

 
Package-on-Board Assembly Concerns and Reliability Improvement in Luminaire Fabrication

Thursday, February 9               11:00am – 11:30am

Speaker:
Ravi Bhatkal
Vice President, Energy Technologies
Cookson Electronics

In the LED lighting industry, surface mount technology (SMT) is relatively a new process. As a result various issues in package-on-board assembly materials and processes need to be addressed along with their impact on reliability. The materials and process used must be designed to take performance and lifetime requirements into consideration. The result of improper materials and process design could be less than optimal performance or, in the worst case, failure of the unit. This presentation outlines issues typically encountered in the LED package-on-board assembly process and optimization of the assembly process. Package-on-board assemblies on a variety of substrates (MCPCBs with different dielectrics), soldering materials (with different alloys) and reflow profiles were evaluated.  Recommendations for material selection and manufacturing process are suggested that enable high reliability luminaire fabrication.

Ravi Bhatkal serves as Vice President, Energy Technologies, at Cookson Electronics, where he has responsibility for new business creation in the Alternative Energy and Energy Efficiency value chains. Previously, Ravi served as VP and General Manager of the global Engineered Products business and led Global OEM Marketing, Strategic Planning, and the corporate New Business Development initiatives at Cookson Electronics. He currently serves on the Industrial Advisory Board of the RPI Smart Lighting Engineering Research Center and the Editorial Advisory Board of Global LEDs/OLEDs Magazine. 

 
Silicone Technology Innovations for LED Lighting Challenges 

Thursday, February 9               11:30am – 12:00pm

Speaker:
Geoff Gardner
Marketing Manager, Lighting
Dow Corning
 

The increasing performance trends for LED components are placing new pressures on material manufacturers to develop solutions that meet the total application, lifetime and cost targets necessary for widespread use in general lighting. Non-traditional materials such as silicones have attracted attention from LED designers due to their excellent thermal stability, optical clarity and processing characteristics.  This talk covers the emerging widespread use of silicones ranging from direct application on the die to final assembly in a lamp, and the technology challenges facing integration of these materials into LED products.

Geoff Gardner is the Global Business Development Manager for the LED Fabrication and Packaging business at Dow Corning.  He joined Dow Corning in 1999 after receiving a PhD from the University of Michigan and is currently based in Midland, Michigan.